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Semiconductor automatic taping machine 3D model
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DESCRIPTION

Semiconductor automatic taping machine, the design principle is to use a 45-degree gravity sliding method so that the product in the material tube can flow down from the material tube by itself. In order to prevent the material from jamming, the air blowing function is added. The pick and place manipulator is completed. The pick and place speed of this manipulator is also very fast. A CCD vision camera can be seen in the middle.

Related Tagslabelautomaticmachineequipmentcontrolproductindustryindustrialmanufactureassemblymechaniccomponentselectricalsemiconductor
taping
industrial machineelectrical components

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Semiconductor automatic taping machine 3D model

Royalty Free License
Created by
c
chanway2012
(3 reviews)
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File formats
IGE
IGES<br />File Size: 73.7 MB
SLDPRT
SolidWorks<br />Version: 2016<br />File Size: 58.4 MB
DWG
AutoCAD<br />File Size: 7.59 MB
FBX
Autodesk FBX<br />File Size: 36 MB
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Geometry
Other
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Unwrapped UVs
Unknown
Publish date
2020-07-28
Model ID
#2533489
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