Photorealistic Mobile Chip - Snapdragon 855 3D model
Photorealistic, high quality 3D model of Qualcomm's Snapdragon 855 Mobile Platform chip.
Fully unwrapped and textured, with high quality materials and 2k maps containing micro-details.
Suitable for close up renders.
Modeled in real world scale - mm.
In addition to the 3D model, you will get fully set V-Ray studio lighting setup scene - ready to render the model as you see it on the last preview images. You can set up any resolution you want and extend the number of frames for the animation to suit your needs (Basic 3DSMax skills needed of course).
Polycount - instanced parts included: Polys: 150,450 Verts: 83,682
Polycount - instanced parts excluded: Polys: 147 Verts: 161
Compatible with 3DSMax 2010 and up. V-Ray and Scanline version available (preview images done with V-Ray).
The exported formats contain only the chip, without the studio lighting setup, and only basic materials. Exported formats: FBX, OBJ, 3DS, glb, gltf, usdz
Please have in mind, that depending on the software you use, the exported formats may not look exactly how you see them in the preview images. In some cases the mesh may appear triangulated and you may need to manually reassign materials/textures .
3D Model formats
Format limitations
- Autodesk 3ds Max (.max) (3 files)23.2 MBVersion: 2010Renderer: V-Ray 3.6Version: 2010Renderer: Default (Scanline) Version: 2010Renderer: V-Ray 3.6
- 3D Studio (.3ds)7.64 MB
- OBJ (.obj, .mtl)9.32 MB
- Autodesk FBX (.fbx)7.73 MB
- glTF (.gltf, .glb) (2 files)1.67 MB
- USDZ (.usdz)812 KB
3D Model details
- Publish date2019-09-10
- Model ID#2090080
- Animated approved
- Rigged
- VR / AR / Low-poly
- PBR
- Geometry Polygon mesh
- Polygons 150,450
- Vertices 83,682
- Textures
- Materials
- UV Mapping
- Unwrapped UVs Non-overlapping
- Plugins used
- Ready for 3D Printing
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