6D Dutch Semi-Conductor Wafer Method - 1 Laser signal splits into 6x ALL Fields EUV Surfaces - Concept.

1 Laser can be split into 6 directions, recmobining to 6 or more surfaces, to work on at thsame time, for perhaps the same chip, but atleast we can split the EUV in two parts, finally working on two sides of the same chip at once, using one laser boost,to create two surfaces. the more surfaces we can create semi-conduictors on, the more energy we save, and more chipswe produce in the same time. a final cubic 6D semiconductor could be placed in a final cylindrical die again, insidea conductive material once more, to be able to reach all sides of the 6D semi-conductor cube. if one laser shone downward,and an angled round mirror was beneath it, that could turn 360 degrees, you could project euv in a radial sequence, working on chips all in a 360 degree circle, one after the other or again with a split into 4 or 6 signals optical euv laser.the same 10kw blast can be used multiple times, split into multiple signals, working on multiple surfaces. perhaps in the future even a dodecahedron semi-conductor lol. lets work on two or more sides of the same coin.or split 3 lasers into 2 signals for 6 surfaces with 1x usable motion all 6x mirrored masks. or simply turn over a single waver cylinder to work on the backside quickly and without much recalibration.

the future is now.

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