DIE bonder pick and place
DIE bonder pick and place 3D model
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DIE bonder pick and place 3D model

Description

This is a high-speed suction device used in chip bonding machines. It is a general high-precision motion mechanism that sucks chips from the wafer table and places them on the substrate!

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DIE bonder pick and place
$2.00
 
Royalty Free No Ai License 
DIE bonder pick and place
$2.00
 
Royalty Free No Ai License 
Ccaecosmos
caecosmos
(1 reviews)
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3D Modeling

3D Model formats

Format limitations
  • Other 15.6 MB

3D Model details

  • Ready for 3D Printing
  • Animated
  • Rigged
  • VR / AR / Low-poly
  • PBR
  • Geometry -
  • Polygons 0
  • Vertices 0
  • Textures
  • Materials
  • UV Mapping
  • Unwrapped UVs Unknown
  • Plugins used
  • Publish date2024-10-28
  • Model ID#5607123

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