chip DIL16

chip DIL16 Low-poly 3D model

Description

Low poly integrated circuit model, chip in DIL16 package. Built with Maya 7, clean topology, no N-gons. UV mapped, unwrapping done with no overlapping, rendered with V-ray (ver. 1.5) renderer in 3ds Max, render scene included. Basic blinn materials with Layered Textures node in Maya file. Maya 7 (.ma, .mb), OBJ (.obj with .mtl), 3ds Max 2009 (.max) and Autodesk FBX (.fbx) format included. FBX and OBJ are directly exported from Maya. Polygons: 857 quads/ 1692 triangles Vertices: 878 Textures included in chip_DIL16_textures.zip file: -1024×1024 pixels .jpg opacity (transparent) map for label, 2 versions -1024×1024 pixels .jpg diffuse (color) map, 2 versions - not used -1024×1024 pixels .psd working map - if you need to change label or make another texture (see thumbs)

Item rating
0 0
chip DIL16
$10.00
 
Royalty Free License 
chip DIL16
$10.00
 
Royalty Free License 
Response 63% in 15.3h
3D Modeling
Low-poly Modeling
Rendering
UV mapping
Hire me

3D Model formats

Format limitations
  • Textures .jpg .psd1.07 MB
  • OBJ (.obj, .mtl) (2 files)68.5 KB
  • Autodesk FBX (.fbx)54.8 KB
  • Autodesk Maya 7 (.ma, .mb)72.9 KBVersion: 7Renderer: Default
  • Autodesk 3ds Max 2009 (.max)94.2 KBVersion: 2009Renderer: V-Ray 1.5

3D Model details

  • Publish date2014-12-04
  • Model ID#94188
  • Animated
  • Rigged
  • VR / AR / Low-poly approved
  • PBR
  • Geometry Polygon mesh
  • Polygons 857
  • Vertices 878
  • Textures
  • Materials
  • UV Mapping
  • Unwrapped UVs Non-overlapping
  • Plugins used
  • Ready for 3D Printing
Help
Chat