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BGA interconnect sockets 1.27 mm grid, through hole solder ta... Free 3D model
Description
BGA interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm. version 1.0.4 3D model made by preci-dip.
Interconnect components.
PRECI-DIP SA Rue Saint-Henri 11P.O. Box 8342800 DelémontSuisse
BGA interconnect sockets 1.27 mm grid, through hole solder ta...
BGA interconnect sockets 1.27 mm grid, through hole solder ta...
3D Model formats
Format limitations
- SketchUp
- OBJ
- STL
- COLLADA
- VRML
- AMF
- 3MF
- DXF 13 - 3D
- IGES
- REVIT
- CATIA V4
- Geomagic Design
- SOLIDWORKS
- Inventor
- AutoCAD (DWG 13) - 3D
3D Model details
- Publish date2016-05-06
- Model ID#402459
- Animated
- Rigged
- VR / AR / Low-poly
- PBR
- Geometry -
- Polygons 0
- Vertices 0
- Textures -
- Materials -
- UV Mapping -
- Unwrapped UVs Unknown
- Plugins used -
- Ready for 3D Printing
Similar Models
to BGA interconnect sockets 1.27 mm grid, through hole solder tails and connecting pin Ø 0.40 mm.
